ABOUT 4-LAYER HIGH POWER GOLDFINGER POWER SUPPLY PCB

Electroplated nickel gold is more generally applied on IC substrates (such as PBGA), generally for binding gold wires and copper wires; but when electroplating C substrates, extra conductive wires need to be produced for the gold finger binding location in advance of electroplating.In short, the 4-layer board has an inner layer. With regards to